Fast reliability qualification of SiP products

A fast moisture sensitivity level qualification method

In this paper, a fast moisture sensitivity level (MSL) qualification method and a fast moisture characterization method are discussed. The fast moisture characterization uses a stepwise method to obtain more reliable and more material moisture properties. The established relationships for moisture diffusion coefficients and moisture saturation levels with respect to the temperature and relative...

Fast Qualification Methods for Microelectronic Packages

Reliability Qualification Challenges of a pHEMT-HBT Hybrid Process

Approach: Wafers and Products The BiHEMT process architecture is a hybrid GaAs/InGaP HBT process co-integrated with an optically-defined 0.7 um gate, InGaP etch-stop, pseudomorphic high electron mobility (pHEMT) process. Both enhancement-mode and depletionmode pHEMT transistors are available. This process offers both power amplifier and RF switch capability, as well as low-noise performance to ...

Cnes Reliability Approach for the Qualification of Mems for Space

This paper describes the reliability approach performs at CNES to evaluate MEMS for space application. After an introduction and a detailed state of the art on the space requirements and on the use of MEMS for space, different approaches for taking into account MEMS in the qualification phases are presented. CNES proposes improvement to theses approaches in term of failure mechanisms identifica...

Fast Handoff for Hierarchical Mobile SIP Networks

layer signalling protocol, SIP offers mobility management capability. However SIP Terminal Mobility suffers from considerable handoff latency which is unsuitable for real time applications and frequent local movements (intra domain handoffs). Hierarchical Mobile SIP (HMSIP) was then proposed as a solution to reduce the SIP handoff delay and to provide a complete micro-mobility solution for SIP ...